摘要
从熔融钎料与母材的相关系和相反应(phase relation and phase reaction)出发,讨论了无铅钎料在铜上铺展率和钎焊性低下的原因,认为是其间过度和过于快速的金属间化合物生长所致。分析了提高无铅钎料本身在铜上铺展率的困难,提出解决无铅钎焊的途径主要是开发有效的钎剂和进行基板母材表面的改性。
The reasons of lower solderability and spreading rate of molten lead free solders on copper base metal have been discussed from thepoint of view of phase relations and phase reactions. It is regarded that too more and too fast growth of intermetallic compounds between moltensolder and base metal are restricted the spreading of molten solder. To enhance solderability and spreading rate of lead free solders themselveson copper is of difficulty, so the effective way is to develop new type of fluxes or modify the surface of copper base metal.
出处
《焊接》
北大核心
2007年第2期6-10,共5页
Welding & Joining
关键词
无铅钎焊
钎料
钎焊性
铺展率
lead free soldering, solder, solderability, spreading rate
