摘要
研究了150℃时效0,200,500 h对Sn3.0Cu0.15Ni/Cu界面组织结构的影响。结果表明:界面金属间化合物层由Cu6Sn5层和Cu3Sn层组成,质量分数为0.15%的Ni的加入会使IMC层最初变厚,但在时效过程中,热稳定性强的界面化合物(Cu,Ni)6Sn5的生成,会抑制Cu3Sn化合物层的生长;同时Ni的加入会降低Cu6Sn5颗粒的长大速度,并且随着时效时间的延长,Cu6Sn5颗粒的形貌呈多面体结构。
The aging effect on the interracial structure of Sn3.0Cu0.15 Ni/Cu was studied at 150 ℃ for 0, 200, 500 h. Results show that the intermetallic compound （IMC） layer at the interface is composed of layers of both Cu6Sn5 and Cu3Sn, the addition of w（Ni）=0.15% increases the initial IMC layer thickness, but during the aging process, the interface compound （Cu, Ni）6Sn5 which possesses thermal stability, can inhibit the formation of Cu3Sn layers; at the same time the addition of Ni will reduce the growing speed of Cu6Sn5 particles, and as the aging time increases, the morphology of Cu6Sn5 particle becomes polyhedron structures.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2012年第12期56-59,共4页
Electronic Components And Materials
基金
浙江省科技计划资助项目(No.2010F20002)
浙江省2010年自然科学基金资助项目(No.Y4100809)
