摘要
研究了多组元无铅钎料Sn-2Cu-0.5Ni和Sn-2Cu-0.5Ni-0.5Au的熔化行为、微观组织、力学性能及与Ni基板的钎焊反应。结果表明:Au的引入降低了钎料合金的熔化温度;2种钎料基体中的金属间化合物(IMC)均基于Cu6Sn5结构,且在260℃下与Ni基板钎焊60s后在接头界面处均生成棒状的(Cu,Ni)6Sn5;通过拉伸试验得到了2种钎料的抗拉强度和延伸率。
The melting behavior, microstructure, tensile property and interracial reactions with Ni substrates of two multicomponent solders, namely Sn-2Cu-0.5Ni （SC-Ni） and Sn-2Cu-0.5Ni-0.5Au （SC-NiAu） were studied. Results show that the addition of Au decreases the melting point of SC-NiAu alloy. The intermetallic compounds （IMC） of the two solders formed in the matrixes are both based on Cu6Sn5 structure. After soldered with Ni substrate at 260℃ for 60 s, stick-like （Cu,Ni）6Sn5 IMC are found at SC-Ni/Ni and SC-NiAu/Ni interfaces. The tensile strength and elongation percentage are obtained by tensile tests, and comparisons are made with eutectic Sn-0.7Cu alloy.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2009年第A01期107-111,共5页
Rare Metal Materials and Engineering
基金
"十一五"国家科技支撑计划重点项目(2006BAE03B02)
