摘要
研究了Cu/InSn-45Ni/Cu复合钎料焊点在300℃时效不同时间的微观组织和剪切性能。结果表明:随着时效时间增加,界面IMC(金属间化合物)厚度呈增加趋势,其界面形貌由扇贝状变为平面状。随着时效时间增加,钎料与Cu基板的Cu原子发生反应,在界面处生成大量脆性相Cu_(3)(In,Sn)。钎缝组织因相变引起体积收缩而形成孔洞,孔洞在时效过程中不断增加,最终聚合形成微裂纹。焊点剪切强度随时效时间增加呈下降趋势,由未时效处理的15.89 MPa降至时效216 h的6.93 MPa。时效后焊点断裂方式由沿晶断裂向穿晶断裂转变。
The microstructure and shear property of Cu/InSn-45Ni/Cu composite solder joints aged at 300℃for different time were studied.The results show that with the increase of aging time,the thickness of the intermetallic compound(IMC)at the interface increases,and the interface morphology changes from scallop shape to planar shape.As the aging time increases,the solder reacts with the Cu atoms of the Cu substrate,and a large amount of brittle phase Cu_(3)(In,Sn)is formed at the interface.The volume shrinkage of the brazing seam structure occurs caused by phase transformation and holes form,which increases continuously during aging process,and finally aggregates to form microcracks.Furthermore,the shear strength of the solder joints decreases as the aging time increases.The shear strength decreases from 15.89 MPa without aging treatment to 6.93 MPa after aging for 216 h.The fracture mode of the solder joints changes from intergranular fracture to transgranular fracture after aging.
作者
杨岳璋
李蓉
张雪灵
杨莉
姜伟
YANG Yuezhang;LI Rong;ZHANG Xueling;YANG Li;JIANG Wei(School of Materials and Energy,Guangdong University of Technology,Guangzhou 510000,China;Shenzhen Jufeng Solder Co.,Ltd,Shenzhen 518000,China;College of Advanced Manufacturing,Guangdong University of Technology,Jieyang 522000,China;School of Mechanical and Electrical Engineering,Soochow University,Suzhou 215000,China)
出处
《热加工工艺》
北大核心
2025年第3期92-95,共4页
Hot Working Technology
基金
国家自然科学基金项目(52165068)
广西自然科学基金项目(2020GXNSFAA297004)。
