摘要
本文探讨了不同的工艺条件对有机多孔体电沉积法所制泡沫镍电阻率的影响。发现两种导电化处理结果相差很大 ,化学镀镍所得产品的电阻率明显高于浸涂石墨基导电胶所得产品。而去除有机体的热处理 ,先在空气中短时间预烧再还原烧结 ,比直接在还原气氛中热解烧结所得产品的电阻率有所降低。
Effect of several different technology conditions on electrical resistivity of the nickel foam produced by electrodeposition on the organic porous body has been investigated,and the results indicate that the product resistivity through chemical plating Ni is distinctly higher than that through soaking in graphite-base conductive colloid as to conductive treatment.While as for the thermal treatment eliminating organism,the resistivity of product through reduction-sintering for quite a long time after burning in air for a short time is a little less than that of product through direct reduction-pyrolysis.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2000年第2期164-166,共3页
Journal of Functional Materials
关键词
泡沫镍
工艺条件
电阻率
制备
nickel foam
technology condition
electrical resistivity
