摘要
采用红外光谱对氰酸酯树脂(CE)改性环氧树脂的共固化反应进行分析,测试了环氧树脂固化物的介电常数(ε)、介质损耗因数(tanδ)和吸湿率,通过TG分析了固化物的热稳定性。结果表明:随着CE含量的增加,环氧树脂固化物的ε、tanδ下降;随着测量频率的增加,固化物的ε下降,tanδ上升。改性环氧树脂的吸水率降低,热稳定性变化较小,介电性能明显提高。
The curing reaction of epoxy resin modified by cyanate ester（CE） was analyzed by infrared spectra. The dielectric constant（e）, dielectric loss factor（tang） and water absorption rate of the cured epoxy resin were tested, and the thermal stability of the cured resin was analyzed by TG. The results show that with the increase of CE content, the e and tang of the cured resin decrease. With the increase of measuring frequency, the e decreases and the tang increases. After modified, the water absorption rate of the epoxy resin decreases, the thermal stability has a little change, and the dielectric property is improved significantlv.
出处
《绝缘材料》
CAS
北大核心
2012年第1期49-51,61,共4页
Insulating Materials
关键词
氰酸酯树脂
环氧树脂
改性
介电性能
cyanate ester
epoxy resin
modified
dielectric property
