摘要
用热机械曲线法(TMA)、傅立叶变换红外光谱(FTIR)研究了氰酸酯/低溴环氧树脂(1∶1)的共固化反应行为、历程,研究了氰酸酯改性不同环氧树脂体系层压板的耐热性能、介电性能和力学性能,同时用动态的TGA研究了共固化体系的热稳定性.结果表明,当低溴环氧树脂/氰酸酯质量比为1/1时,固化反应首先是氰酸酯发生自聚形成三聚体(三嗪环),然后三嗪环很快与环氧基反应形成异氰脲酸酯,异氰尿酸酯再与环氧树基反应生成唑烷酮.同时,氰酸酯单体直接与环氧基反应生成唑啉进而转变成唑烷酮.随着氰酸酯质量分数的增加,共固化物的玻璃化转变温度Tg和介电性能增加,抗弯强度减少,残碳量增加.
The co-curing behavior and reaction mechanism of low brominated epoxy(LBE)/cyanate (1/1) were studied by TMA and FT-IR .Dielectric and mechanical properties of laminate made up of various cyanate-modified epoxy resin were studied. In addition, thermostability of co-curing system was also studied by TMA and dynamic TGA.The reaction mechanism (W low brominated epoxy /W cyanate=1∶1)can be discribed as follows: At first it happens cyclotrimerization of cyanate. Then, the so formed trimer react with epoxy group to give isocyanurate, and finally oxazolidinone was produced. At the sametime, cyanate react with epoxy group directly to produce oxazoline, then it transforms into oxazolidinone. Glass transition temperature(T_g) and char yield increase with increasing content of cyanate, dielectric performance is improved.
出处
《浙江大学学报（理学版）》
CAS
CSCD
2003年第6期657-662,共6页
Journal of Zhejiang University（Science Edition）
