摘要
运用Ansys/LS-DYNA模拟引线键合过程,研究分析了键合力、焊盘材料属性、摩擦系数等参数在引线键合过程中对焊球和焊盘应力分布及变形的影响,并将仿真分析结果应用于实验室开发的引线键合机,为键合机的研发和调试提供了理论参考,改善了键合机的键合质量和键合稳定性。实验测量结果表明,有限元分析方法是有效的,结果是合理的,有一定的参考价值。
The analysis of ultrasonic wire bonding was performed by means of finite element method.The effect of the bond force、material properties and the friction coefficient were investigated by deformation analysis of the Au ball by finite element method.The results of the deformation analysis gave valuable advice to the research of wire bonder.The experimental data from the new wire bonder made by our lab show that the result is helpful to improve the quality of bonding,and the finite element method is efficient and feasible.
出处
《机械设计与制造》
北大核心
2011年第2期17-19,共3页
Machinery Design & Manufacture
基金
广东省科技攻关项目(2008A010300009)
广东省中国科学院全面战略合作项目(2009B091300057)
关键词
引线键合
有限元方法
变形分析
Wire bonding
Finite element method
Deformation analysis
