摘要
在超声引线键合过程中,键合压力是影响键合强度的重要因素之一。通过实验,研究了键合强度与键合压力间的关系。通过高频采集装置对键合压力进行了标定并分析了其对键合强度以及电流电压产生的影响。实验发现,只有在键合压力适中的情况下,键合强度才能达到最大。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength. The article analyzed the relations between the bonding pressure and the bonding strength through the experiment. Through the high frequency sampling-device, the bonding pressure was demarcated; the influence on the voltage, current was studied. The experiment showed that only when the bonding pressure in a moderate conditions can the largest bonding strength be reached.
出处
《压电与声光》
CSCD
北大核心
2007年第3期366-369,共4页
Piezoelectrics & Acoustooptics
基金
国家自然科学基金资助项目(50575230
50390064
50429501)
"九七三"计划基金资助项目(2003CB716202)
关键词
压电换能器
超声引线键合
键合压力
键合强度
piezoelectric transducer
ultrasonic wire bonding
bonding pressure
bonding strength
