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超声换能系统电特性实验研究

Study on Electricity Characteristic of Ultrasonic Transducer System
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摘要 超声换能系统是引线键合设备的核心部件,对其工作特性的深入了解有助于理解引线键合过程。通过实验,观察分析了超声引线键合过程中不同劈刀安装长度对换能系统电流、电压及功率的影响,发现电流及功率在不同劈刀安装长度时有较为明显的变化。并进一步采用小波分析方法展现了电流信号在时频域内变化的细节情况,为充分了解换能系统电学特性提供了可靠依据和新的方法。 Ultrasonic transducer system is the most important part of the bonding machine, understanding the ultrasonic wire bonding process is helpful. The influence on the current, voltage and power at different capillary mounted length conditions were discussed. Experiment results show that current and power will differ at different mounted lengths of the capillary distinctly, The analysis with the wavelet shows the detail of current signal changing in the joint time-frequency, this will offer a new and reliable way to understand the electricity characteristic of ultrasonic wire bonding system.
作者 姚钢 韩雷
出处 《半导体技术》 CAS CSCD 北大核心 2008年第6期497-500,共4页 Semiconductor Technology
基金 国家自然科学基金(50575230) 国家973资助项目(2003CB716202) 国家自然科学基金面上项目(50675227)
关键词 劈刀安装长度 超声引线键合 小波 mounted length of capillary ultrasonic wire bonding wavelet
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  • 1Harman, George G., Johnson, Christian E. Wire bonding to advanced copper, low-k integrated circuits, the metal/dielectric stacks, and materials considerations[J]. IEEE Transactions on Components and Packaging Technologies, 2002,25:677-683.
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  • 3Chylak, Bob; Kumar, Suresh; Perlberg, Gil. Optimizing the wire bonding process for 35-mm ultra-fine-pitch packages[C].Proceedings of SEMICON Singapore 2001 Technical Symposium, 2001, Singapore.
  • 4Kripesh, Vaidyanathan. Wire bonding process impact on low-k dielectric material in damascene copper integrated circuits[C]. Proceedings of the 2002 Electronic Components and Technology Conference, 2002. 873-880.

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