摘要
介绍了引线键合工艺流程、键合材料及键合工具,讨论分析了影响引线键合可靠性的主要工艺参数,说明了引线键合质量的评价方法,并提出了增强引线键合可靠性的措施。
This article introduces the processes,materials and tools of wire bonding, the main process parameters influencing on reliability, the methods for quality inspection and the methods to improve the bonding reliability.
出处
《电子工业专用设备》
2008年第3期53-60,共8页
Equipment for Electronic Products Manufacturing
