摘要
在纳米硬度计上对单晶硅进行了微压痕测试实验,以对单晶硅的微观力学性能有所认识。微压痕测试表明:单晶硅的弹性模量在压入载荷小于2400μN的范围内随载荷变化而波动变化;而在压入载荷大于2400μN后保持相对的稳定值(约为214GPa);单晶硅的表面硬度在压入载荷小于1000μN的范围内随载荷变化而线性增大,而后突然降低并保持相对的稳定值(13.5GPa^15GPa);单晶硅在纳米压入过程中,材料的破坏形式为脆性破裂,并且随压入载荷的增大而在压痕边沿产生堆积,堆积程度亦逐渐增大。
In order to evaluate the micro mechanical properties of single crystal silicon which are commonly applied in MEMS,a serial of nano-indentation were performed on TriboIndenter,a full featured nano-mechanical test instrument.The results revealed that the micro-mechanical properties of single crystal silicon vary under a certain micro normal load,less than 2400μN.Pile-up and brittle failure occurred on single crystal silicon against micro deformation.
出处
《材料开发与应用》
CAS
2010年第5期30-33,共4页
Development and Application of Materials
