摘要
密封封装内部的水汽对于半导体器件的可靠性是一种威胁,由此导致的硅表面铝金属线的腐蚀是一种主要的失效机理。为了防止密封封装内部发生腐蚀失效,从而提高器件的可靠性,美军标和我国国军标均给出了内部水汽含量的试验流程和判据。然而另一些研究表明,水汽的单独存在并不会导致铝线腐蚀失效。研究了水汽在密封器件的腐蚀失效机理中的作用,对硅表面铝线的腐蚀过程进行了数学描述,分析了目前标准中内部水汽含量判据,并给出了防止密封器件腐蚀失效的建议。
The internal moisture in hermetic packages is hazardous to the reliability of semiconductor devices,and the corrosion of the aluminum metal traces on the silicon surface caused by the moisture is the main failure mechanism.To prevent the corrosion failure in hermetic packages and improve the reliability of semiconductor devices,the test procedure and criteria for the internal moisture content were presented in both the military standards of the USA and China.But other researches indicated that the moisture alone would not cause corrosion failures of the aluminum metal traces.In this article,the role of moisture in the corrosion failure mechanism of hermetic devices is discussed.The corrosion process of the aluminum metal traces on the silicon surface is described mathematically.The criteria of internal moisture content in current standards is analyzed and some advices for preventing the corrosion failure of hermetic devices are provided.
出处
《电子产品可靠性与环境试验》
2010年第5期18-22,共5页
Electronic Product Reliability and Environmental Testing
关键词
密封封装
内部水汽含量
腐蚀
失效机理
集成电路可靠性
hermetic package
internal moisture content
corrosion
failure mechanism
IC reliability
