摘要
免清洗焊膏在回流焊接过程中,产生大量透明的固体残留物,分布在焊盘四周。对于军用电子等高可靠性设备,残留物不仅影响印制板表面涂覆质量,而且影响产品的可靠性。研究了助焊剂残留物的半水清洗工艺,通过光学检查和离子浓度检测检查清洗质量。在工艺试验的基础上,掌握了关键要素和控制方法,确定了合适的工艺参数,用于生产作业指导。
After the reflow soldering,a large amount of solid residues of RMA solder left around the pad.The residues have a strong impact on PCB protective coating quality and electronic equipment reliability such as military electronic equipment.The semi-aqueous cleaning process of the residues is studied.Cleaning quality is checked by optic inspection and ion concentration inspection.The key factors and control method is learned,and proper process parameters was got based on the cleaning process experiment.
出处
《电子工艺技术》
2010年第4期209-211,244,共4页
Electronics Process Technology
关键词
助焊剂残留物
半水清洗工艺
清洗剂
光亮剂
离子浓度
Fux residue
Semi-aqueous cleaning process
Clean solvent
brightness solvent
Ion concentration
