摘要
针对现有松香固体助焊剂活性温度低和焊后变色的问题,研制了以十八酸、聚乙二醇和少量耐热松香作为载体,以己二酸和癸二酸复配作为活性剂的非松香基固体助焊剂。此助焊剂常温下为白色膏状,熔点范围110℃～130℃,满足Sn-0.7Cu无铅药芯焊锡丝灌芯和拔丝工艺。助焊剂中各成分沸点在300℃左右,满足手工烙铁焊高温要求大大减少焊接飞溅,测试飞溅仅为0.16%。试验测定焊前焊后表面绝缘电阻均达到国家一级标准1×1012Ω。其铺展率好,助焊效果理想。该助焊剂在高温助焊活性、稳定性和焊后腐蚀性等方面都符合标准,焊后焊点饱满光亮,残留物无腐蚀。
A non-rosin based flux was developed due to the problems of solders which are no activity at high temperatures and have discoloration after soldering associated with some conventional fluxes,using stearic acid,Polyethylene glycol（PEG）,and a small amount of heat-resistant rosin as the vector,and a combination of adipic acid and sebacic acid as the active agent.This flux is a white paste at room temperature,and is found to have a melting point 110 ℃～130 ℃,which is suitable for wire-core grouted and wire-drawn Sn-0.7Cu lead-free solder.The boiling points of each component are about 300 ℃,meeting the requirements of a high temperature for manual soldering.Also,splash was reduced significantly,and was only 0.16% in tests.Experimental measurement showed that the insulation resistance of the surface reached the standard of 1×1012 Ω,and it was found that its spreading rate was comparable to the commercial fluxes.Importantly,the soldering results were satisfactory.The activity characteristics at high temperatures,stability,corrosion resistance,and other variables of the flux,all reached established soldering standards,achieving full bright spot solder,with no corrosion residue.
出处
《电子工艺技术》
2011年第2期63-67,75,共6页
Electronics Process Technology
关键词
药芯焊锡丝
助焊剂
无铅焊
Cored solder wire
Flux
Lead-free soldering
