摘要
介绍电子行业电镀可焊性锡铅合金体系的发展，比较了优缺点。
The development of solderable Sn Pb alloy system used in electronic industry, including its advantages and disadvantages, is presented. Alkyl sulfonate system is considered, a promising Sn Pb plating system.
出处
《电镀与环保》
CAS
CSCD
北大核心
1999年第1期8-10,共3页
Electroplating & Pollution Control
关键词
锡铅合金
电镀
可焊性
镀层
镀合金
Tin lead alloy Electroplating Solderable plating
