摘要
】在ＩｎＳｂ薄膜制备过程中，用机械磨抛的方法，探索了Ｉｎ２Ｏ３氧化膜的去除和ＩｎＳｂ敏感膜层的减薄、抛光等技术问题，从而提出一种新型磨抛工艺。文章介绍了该工艺的基本原理及不同工艺规范的磨抛结果。
This paper has investigated the technological problems such as the removing In 2O 3 film lager and thinning and polishing the InSb sensitive film lager by means of mechanical abrading and polishing during the preparation of the InSb thin film and introduced a novel abrading and polishing processing.The basic principle of this technology and the abrading and polishing results of different work programs are described in this paper.
出处
《仪表技术与传感器》
CSCD
北大核心
1998年第10期13-15,共3页
Instrument Technique and Sensor
关键词
INSB薄膜
磨抛工艺
补偿技术
传感器
InSb Thin Film,Polishing Processing,Compesnation techniques.
