摘要
浸镀是印刷电路板(PCB)终饰工艺中的主流技术.对比研究了PCB上浸镀银和锡的机理、基本过程及其形成镀层的显微形貌,并对PCB上浸镀金和钯的技术特点、显微形貌进行了说明.
Immersion plating is the main technology of final surface finishing process for publishing circuit board（PCB）.In the paper,the mechanism,rudimental process and surface morphology of the immersion silver and immersion tin on PCB are studied contrastively.The technical characteristics and surface morphology of immersion gold and immersion palladium are explained,too.
出处
《兰州交通大学学报》
CAS
2009年第6期141-144,共4页
Journal of Lanzhou Jiaotong University
关键词
浸镀
机理
过程
技术特点
显微形貌
immersion
mechanism
process
technical characteristic
surface morphology
