摘要
利用先进的电化学系统,通过测定铜-银电偶电流,分别对有无络合剂条件下印刷电路板浸镀银的沉积速度进行测定,并将测定结果与常规的容量滴定法进行对比。结果表明,与常规的容量滴定法相比,采用电偶电流法测定浸镀银的沉积速度,不仅直观、方便、速度快,而且能进行在线检测,有利于及时对印刷电路板的浸银工艺进行调整。
The electrodeposition rate of immersion silver plating for printed circuit board （PCB） was measured by galvanic current method via advance electrochemical system. The testing values were compared with those measured by ordinary capacity titration. The result shows that the advantages of galvanic current method over ordinary capacity titration are more direct, convenient, faster and can be tested on-line, being suitable for timely adjusting the technology of immersion silver plating for PCB.
出处
《福建工程学院学报》
CAS
2007年第1期11-14,24,共5页
Journal of Fujian University of Technology
基金
福建省重点国际合作项目(2002I011)
关键词
镀速检测
浸镀银
印刷电路板
electrodeposition rate testing
immersion silver
printed circuit board
