摘要
通过两个带有镀金接插件的手机PCB腐蚀失效的实例,从元件表面出现的腐蚀失效的现象出发,结合这些失效部位的腐蚀形貌、腐蚀产物等特点,分析了手机PCB上接插件镀金表面层在自然存放条件和加速腐蚀条件下出现腐蚀失效、达不到有效保护作用的主要原因,包括表面镀金层本身存在孔隙、划痕等表面缺陷,电镀过程中引入污染物,装配过程中形成缝隙等;另一个重要原因是镀金层厚度薄,不能提供足够的防护性能。并针对这些因素提出了相应的改善措施和建议。
Two corrosive failure cases of PCB with parts of Au-plating for mobile telephone have been analyzed. Based on the failure phenomena, the corrosive morphologies and compositions of the failure sites have been detected. The results indicated that the factors resulting in the failure of the Au-plating included the surfaced defects, the contamination from plating and assembling, as well as the insufficient Sickness of the Au-plating itself. According to these factors, the corresponding corrective actions are presented.
出处
《电子产品可靠性与环境试验》
2006年第4期4-8,共5页
Electronic Product Reliability and Environmental Testing
