摘要
NCIC置换镀锡工艺是一种既可焊又可键合的有效取代热风整平的新工艺。介绍了该工艺的特点、工艺流程及规范,以及镀液组分分析及其维护。研究了镀液组成及操作条件对沉积速率的影响。测定了不同条件下银镀层的焊接性能和键合性能,结果表明,该置换镀银层分别经烘烤、潮湿试验、多次回流及在H2S气体中变色试验后焊接性能和键合性能仍然优良。
The process of replacement Ag plating with NCIC additive is an alternative to hot-air solder leveled process, and whereby weldable and bondable Ag deposits can be obtained. The features, flow and specifications of the process, and the component analysis and control of the plating bath were introduced. The effect of the bath composition and process conditions on deposition rate was studied. The solderability and bonding of the Ag deposits under different conditions were tested. Results show that the Ag deposits maintain good solderability and bonding after being treated by baking, damping test, reflow for several times and tarnishing test in H_2S gas respectively.
出处
《电镀与涂饰》
CAS
CSCD
2004年第3期22-25,36,共5页
Electroplating & Finishing
关键词
印制板
置换镀银
焊接性能
键合性能
PCB (printed circuit board)
replacement Ag plating
solderability
bonding
