摘要
研究了石墨表面化学镀铜对粉末冶金法制备铜石墨材料的抗弯强度的影响，结果表明，随石墨含量变化（体积分数为６％～２０％），材料抗弯强度较未镀的提高１３．８％～１５．５％，其本质是化学镀降低材料的孔隙度。材料的抗弯强度σｂｂ与孔隙度θ符合指数关系：σｂｂ＝σｂｂ０·ｅｘｐ（－βθ），化学镀使β值升高。通过金相组织及断口形貌观察，发现化学镀使石墨分布更加均匀，且使石墨—铜的界面结合强度提高。
Effect of electroless copper plating on the bending strength of the copper graphite material made by powder metallurgy has been studied. It is found that the bending strength of the material with graphite content of 6 vol%～20 vol% increases by 13 8%～15 5% in virtue of the decrease of porosity after electroless plating. The bending strength, σ bb , and porosity, θ , of the material fit the equation: σ bb = σ bb0 ·exp(- βθ ),and the electroless plating process causes β to increase, microscopic observation shows that electroless plating leads to more homogeneous distribution of graphite and the increase of the bending strength of the copper-graphite interface.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
1998年第3期182-185,共4页
Rare Metal Materials and Engineering
