摘要
以纯铜为基体,以WC、AlN、TiN、MgB2等具有不同导电性能与密度的陶瓷颗粒为增强相,采用粉末冶金工艺制备了WCp/Cu、AlNp/Cu、TiNp/Cu和MgB2p/Cu系列复合材料.研究了不同增强颗粒、制备工艺的不同环节对铜基复合材料导电性能的影响.结果表明:相同制备工艺及体积分数条件下,以具有不同导电性能与密度的陶瓷颗粒作为增强相的铜基复合材料的导电性能相近,混粉、压制、烧结、复压及复烧等工艺环节对铜基复合材料导电性能有不同程度的影响,提高铜基复合材料的致密度为提高其导电性能的关键.
WCp, AINp,TiNpand （MgB2）P with different electrical conductivity and density were used to be prepared copper - matrix composites by powder metalluegy technology. The influences of different particles and different link of fabricating technology on electrical conductivity of copper - matrix composites were studied. As a results, copper- matrix composites reinforced with different electrical conductivity and density particles have near electrical conductivity under condition of the same fabricating technology and particle volume content. Blending, pressing, sintering, repressing and resintering have different influences on electrical conductivity of copper - matrix composites. The key of improving electrical conductivity of copper - matrix composites is to increase the densification of copper - matrix composites.
出处
《材料科学与工艺》
EI
CAS
CSCD
北大核心
2005年第4期347-351,共5页
Materials Science and Technology
基金
国家自然科学基金资助项目(50271024)河北省自然科学基金资助项(501013).
关键词
粉末冶金
颗粒增强
铜基复合材料
制备工艺
导电性能
powder metallurgy
particle reinforce
copper - matrix composites
fabricating technology
electrical conductivity
