摘要
研究了以ＳｎＣｌ２代替价格昂贵的ＰｄＣｌ２活化钨粉，以联氨作还原剂，用化学镀方法制取高活性、高均匀性Ｃｕ、Ｎｉ包Ｗ复合粉末。
W coating Cu Ni compound powder with high activity and uniformity is manufactured by immersion plating,in which SnCl 2 instead of PdCl 2 is used to activate tungsten powder and biamine is used as reducing agent.The authors measured the compound powder′s physical properties and its alloy′s performance.
出处
《矿冶工程》
CAS
CSCD
北大核心
1996年第3期64-68,共5页
Mining and Metallurgical Engineering
关键词
化学镀
复合粉末
合金
性能
Immersion plating, Compound pewder, Alloy performance
