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氩离子轰击对射频溅射法制备的a-SiC∶H膜退火形成6H-SiC的影响 被引量:9

Effect of Argon Ion Bombardment on Formation of 6H SiC Prepared by Annealing of RF Sputtering a SiC∶H Film
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摘要 本文对射频溅射法淀积的a-SiC∶H膜热退火形成6H-SiC相进行了研究.我们采用红外透射谱、喇曼背散射谱和X光衍射谱来研究退火形成6H-SiC的过程.在较高的射频功率下淀积的a-SiC∶H膜经800℃60分钟等时退火后转变为6H-SiC相,该温度低于在低功率下制备的a-SiC∶H形成6H-SiC的温度(1000℃).高功率可导致6H-SiC形成温度的降低与膜中硅及石墨团簇的消失,同时高能量的氩离子轰击可使膜中氢含量减少及各组分均相.通过改变射频功率,本文研究了氩离子轰击对a-SiC∶H膜及形成6H-SiC的影响. Abstract The formation of 6H SiC phase is studied through the annealing of a SiC∶H films prepared by reactive r.f. sputtering method. The infrared transmission, Raman scattering and X ray diffraction spectra were used to characterize the composition and structure of films. After an isochronal annealing for 60min, a SiC∶H films deposited at higher r.f. power were changed into the 6H SiC phase at 800℃, while 1000 ℃ was required for the phase change of those deposited at lower power. High power causes the decrease of the 6H SiC formation temperature and the disappearance of silicon or carbon cluster existed in the films. The bombardment of energetic argon ion leads to the decrease of hydrogen content and the homogenity of the films. This enhancement of the 6H SiC formation is discussed in connection with the effect of argon ion bombardment through r.f. power variation on a SiC∶H films.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 1998年第8期569-573,共5页 半导体学报(英文版)
基金 国家自然科学基金
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