摘要
详细介绍了一种焊膏配用焊剂的研制过程，主要介绍焊剂体系的各种组份及其对焊剂和焊膏性能的影响。该焊剂可以配用Ｓｉ－Ｐｂ－ＢｉＳｉ－Ｐｂ－Ｉｎ等低熔点焊料制成特种焊膏（１７０℃下焊接），或配用Ｓｉ－Ｐｂ焊料制成普通锡铅焊膏。
This article introduces a flux suited for solder cream in full details,analysis all the ingredients of this flux and its effect to the flux and solder cream,this flux can be mixed with the low melting point alloy powder such as Si-Pb-Bi or Si-Pb-In to formulate a solder cream which can be used in low temperature reflow soldering or it can be mixed with the Si-Pb alloy-powder to formulate a general solder cream.
出处
《电子工艺技术》
1998年第2期58-59,63,共3页
Electronics Process Technology
关键词
焊膏
焊剂
活化剂
焊剂活性
Solder cream Flux Activator Activating of flux
