摘要
用无铅焊膏代替传统的Sn-Pb焊膏是近年来研究的热点。本文比较了Sn-Ag,Sn-Zn,Sn-B i系无铅焊料的优缺点并介绍了国内外对Sn-Ag,Sn-Zn,Sn-B i系无锅焊料研究所取得的研究成果,并详细阐述了助焊剂的分类以及主要活性成分的用途。
Inventing new and practical lead -free solder paste replacing traditional Sn -Pb solder paste has been become the focus of study recently. In this paper, the advantage and disadvantage of Sn - Ag, Sn - Zn, Sn - Bi based lead - free solders were reviewed. The paper also introduced the effects of the mainly active component and the categories about the flux agent. There are sixty - eight references.
出处
《化学研究与应用》
CAS
CSCD
北大核心
2006年第5期472-478,共7页
Chemical Research and Application
关键词
无铅
焊膏
助焊剂
焊料
lead - free
solder
solder paste
flux
