摘要
研制了一种新的用于无铅焊锡线中的无卤素助焊剂,选取芳香族酸、二元羧酸以及有机胺为活性剂主要成分。并参考日本工业标准JIS-Z-3282-2000和相关国家标准GB/T 9491-2002对其进行了全面的性能测试。结果表明,该助焊剂在可焊性、绝缘性、腐蚀性等方面均符合标准。扩展率大于80%;表面绝缘阻抗大于1011Ω;无腐蚀性。且具有焊接效果良好、无卤素、无毒、环保,焊后免清洗等优点。
A new type of halogen -free no -clean flux used in lead -free solder wire was developed. The main active ingredients of the flux consist of dicarboxylic acid, aromatic acid and organic amine. According to JIS -Z -3282 -2000 and relative GB/T 9491 -2002 ,many performance tests were done. The resuits show that this flux has fulfilled requirements of the standard in insulatibity,causticity and solderability. The spreading ratio is not less than 80% ,the surface insulation resistance is more than 10^11Ω,and the causticity is no corrosion. In addition ,this flux has many good performances ,such as excellent soldering performance, halogen -free, non poisonous, environment friendly and no -clean after soldering.
出处
《电子工艺技术》
2007年第5期264-267,共4页
Electronics Process Technology
关键词
焊锡线
无卤素
助焊剂
环保
Solder wire
Halogen - free
Flux
Environment friendly
