摘要
为了解决SU-8光刻胶电铸金属模具中遇到的光刻胶脱落和电铸后去胶难等问题,提出了采用硅橡胶(PDMS)微复制与电铸毛细管电泳芯片金属模具相结合的新工艺。该方法首先用SU-8光刻胶制备微通道阳模,以此为模版浇注PDMS阴模,然后在此PDMS阴模上电镀金属模具。与采用SU-8光刻胶电镀金属模具相比,此方法不存在光刻胶与衬底结合力差以及去胶难等问题,所制备的金属模具侧壁垂直,表面光滑。
A novel method was proposed using SU-8 as the electroplating mold, prepared by this method shows smooth SU-8 removal. to prepare a microfluidic mold insert. Instead of directly a PDMS replica was employed. The metallic mold insert surface and vertical walls while without the difficulty of
出处
《微细加工技术》
EI
2005年第4期56-58,75,共4页
Microfabrication Technology
基金
国家863MEMS重大专项资助项目(200211404150)
国家863计划资助项目(2004AA404260)
