摘要
概述了高纯铝箔在含氯离子的溶液中电解腐蚀时外加极化电流或电位、交流电频率、电解液中的氯离子浓度、腐蚀温度、铝的立方织构等因素对蚀坑萌生和蚀坑发展动力学（包括蚀坑的密度、形状、尺寸、生长速度等）的影响机制，并总结出一些重要结论，同时也提出了有待进一步研究解决的问题。
The work reviewed published papers on the mechanism of the effect of applied polarization current/potential,AC frequency, chloride concentration, etching temperature, Al cubic texture, etc. on pitting and pit propagation kinetics, including density, shape,size and pit growth rate, etc. The important points acknowledged by the investigators and the existing problems are summarized.
出处
《电子元件与材料》
CAS
CSCD
1997年第6期1-11,共11页
Electronic Components And Materials
关键词
铝箔
电解腐蚀
扩面理机
铝电解电容器
Al foil, Electroetching, mechanism of extending surface area
