摘要
采用磁控溅射和电镀相结合的方法制备了PI/Cu挠性覆铜板并研究了不同电流密度对产品性能的影响。结果表明:电流密度越大则镀层的沉积速度越快,从而导致镀层的晶粒粗大,镀层电阻变小,附着力下降;采用该方法制备的PI/Cu挠性覆铜板镀层厚度及电阻都比较均匀。
The PI/ Cu FCCL was prepared using magnetron sputtering and electroplating method; and the effect of current density on the performance of the products was researched. The results show that the increase of current density will speed up the deposition rate of the coatings, which will result in the grain coarsening, and decreasing of resistance and adhesion of the coatings. The thickness and resistance of the coatings are relatively uniform.
出处
《绝缘材料》
CAS
2008年第4期6-8,共3页
Insulating Materials
基金
国防基础科研(B0920061337)
关键词
磁控溅射
电镀
挠性覆铜板
magnetron sputtering
electroplating
flexible copper clad laminate
