期刊文献+

陶瓷球高效研磨技术的研究 被引量:3

Study on high efficiency lapping technology for ceramic balls
在线阅读 下载PDF
导出
摘要 为提高陶瓷球研磨过程中的加工效率,本文提出了一种采用固着金刚石磨料的高效研磨技术。采用4~8μm粒径的金刚石微粉作为磨料,以光固化树脂作为结合剂,在300~500 nm波长紫外线照射下,使光固化树脂快速固化,制作固着磨料研磨盘(金刚石浓度100%),以φ5 mm氮化硅陶瓷球为加工对象,在自行设计的实验台上进行了加工实验。实验结果表明,在保证表面质量的前提下(R_a~40 nm),材料去除率可达100μm/h,其研磨效率约为相同加工条件下传统游离磨料加工的20倍。对加工后陶瓷球表面的观察发现,氮化硅陶瓷球材料主要是以二体磨损的形式去除的。 To improve the machining efficiency of ceramic balls in lapping process, a high efficiency lapping technology using fixed abrasive plate is put forward in this paper. Diamond abrasives (4 -8 μm girt size) are bonded quickly by photosensitive resin and then exposed under 300 -500 nm wavelength ultraviolet ray to fabricate fixed abrasive plate. φ5 mm silicon nitride balls are lapped with the above fabricated fixed abrasive plate. The results showed that the material removal rate under the experimental conditions was 100 μm/h, which is about 20 times higher than that in case of conventional free abrasive lapping, and the roughness R, was about 50 nm, close to that by conventional lapping. It is also identified with microscopy that groove wear is the dominant material removal mechanism in the fixed abrasive lapping process.
出处 《金刚石与磨料磨具工程》 CAS 北大核心 2008年第4期52-56,共5页 Diamond & Abrasives Engineering
基金 国家自然科学基金项目(50705028)资助
关键词 陶瓷球 金刚石磨料 光固化树脂 材料去除率 ceramic balls diamond abrasive photosensitive resin material removal efficiency
  • 相关文献

参考文献10

  • 1Jiang M, Komanduri R, Chemical Mechanical Polishing (CMP) in Magnetic Float Polishing (MFP) of Advanced Ceramic ( Silicon Nitilde) and Glass ( Silicon Dioxide) [ J ]. Key Engineering Materials, 2001, 202 -203:1 -14.
  • 2Wang R W, Snidle, L Gu. Rolling contact silicon nitride bearing technology: a review of recent research[ J]. Wear, 2000, 246:159 - 173.
  • 3陶宝春,王志伟,吕冰海,黄建平,何雪华,袁巨龙.陶瓷球双自转盘研磨方式下研磨均匀性的研究[J].金刚石与磨料磨具工程,2006,26(4):43-47. 被引量:10
  • 4Tani Y, Kawata K. Development of high - efficient fine finishing process using magnetic fluid [ J]. Annals of the CIRP, 1984, 33: 217 - 220.
  • 5Umehara N, Kirtane T, Gerlick R, Jain V K, Komanduri R. A new apparatus for finishing large size/large batch silicon nitride ( Si3 N4 ) balls for hybrid bearing applications by magnetic float polishing (MFP) [ J]. International Journal of Machine Tools & Manufacture, 2006, 46:151 -169.
  • 6Child T H C, Moss D J. Grinding ratio and cost issues in magnetic and non - magnetic fluid grinding [ J ]. Annals of the CIRP, 2000, 49(1) : 261 -255.
  • 7康仁科,田业冰,郭东明,金洙吉.大直径硅片超精密磨削技术的研究与应用现状[J].金刚石与磨料磨具工程,2003,23(4):13-18. 被引量:60
  • 8Eda H, Zhou L, Nakano H, Kondo R, Shinizu J. Development of single step grinding system for large scale Ф300 Si wafer: A total integrated fixed - abrasive solution [J]. Annals of CIRP, 2001,50( 1 ) : 225 - 228.
  • 9Lv B H, Yuan J L, Yao Y X, Wang Z W, Tao B C, Zhen J J,Zhao P. Study on Wear Mode of Silicon Nitride Bails in Lapping Process [ J ]. Key Engineering Material. 2006, 304 - 305 : 403 - 407.
  • 10彭伟,高涛,姚春燕.光固化树脂结合剂锯片结合机理及其应用研究[J].中国机械工程,2006,17(20):2148-2150. 被引量:7

二级参考文献22

  • 1吴健伟,赵玉宇,赵汉青,何影翠,匡弘,于昕,付春明.UV-固化胶黏剂收缩率的研究[J].化学与粘合,2005,27(2):96-100. 被引量:22
  • 2何雅全 吴明根.超精密加工技术基础[M].北京:超精密加工技术国防科技重点实验室,1993..
  • 3郭东明 康仁科 金洙吉.大尺寸硅片的高效超精密加工技术[A]..中国机械工程学会2002年年会论文集[C].机械工业出版社,2002.12.
  • 4P.O.Hahn. The 300 mm silicon wafer-A cost and technology challenge[J],Microelectronic Engineering, 2001(56): 3~13
  • 5Shayne La Force. Meeting market Requirements through innovation[J]. The new DBC Process,TAP technology, 2001:71~73.
  • 6Ernst Gaulhofer,Heinz Oyrer. Wafer thinning and strength enhancement to meet emerging packaging requirements[C],IEMT Europe 2000 Symposium,April,06~07,Mynich, Germany.
  • 7H.K.Tonshoff, W.V.Schmieden, et al., Abrasive Machining of Silicon[C]. Annals of CIRP Vol.1990,39(2):621~634.
  • 8S.Matsui. An experimental study on the grinding of silicon wafer-the wafer rotation grinding method (1st report). Bull. Japan Soc. Prec. Eng. 1988,22(4):295~300.
  • 9Z..J.Pei, Alan Strasbaugh. Fine grinding of silicon wafers[J]. International Journal of Machine Tools and Manufacture 2001,41:659~672.
  • 10Z..J.Pei, Alan Strasbaugh. Fine grinding of silicon wafers:designed experiments[J] International Journal of Machine Toolsand Manufacture 42(2002)394~404.

共引文献74

同被引文献16

引证文献3

二级引证文献8

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部