摘要
随着我国半导体工业集成电路(IC)业的快速发展,硅材料加工用金刚石工具具有巨大的潜在市场。作者简介了半导体加工中使用的各种金刚石工具:其中包括:单晶硅晶锭的裁切与整圆、晶圆线切割、倒圆磨边、磨削、CMP修整器、背面减薄与划片及其最新发展。详细介绍了各种不同类型CMP修整器及其完善与发展。建议应积极研发我国半导体工业硅材料加工用金刚石工具。
With rapid development of integrated circuit（IC） in China ＇s semiconductor industry,diamond tools are get ting great potential market in cutting silicon materials.Different diamond tools used in semiconductor industry are introduced and described,including tools for cutting and grinding of outside diameter of Si ingot,wafer wire sawing,wafer edge grinding,grinding and finishing,CMP（chemical mechanical polishing） pad conditioner,back thinning grinding of wafer,dicing of chips and their new progress.Different type of CMP pad conditioners are introduced in detail,and their improvement ＆ development is described.Actively researching and developing diamond tools for cutting silicon materials in semiconductor industry is suggested by the authors.
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2008年第1期73-81,共9页
Diamond & Abrasives Engineering
关键词
半导体
集成电路
精密金刚石工具
semiconductor,integrated circuit（IC）,precision diamond tools
