摘要
基于流体动压理论,研究了单晶硅自由磨料线锯切片过程中的流体动压效应。通过自柔顺系数来体现锯丝各节点受径向力作用下所产生位移的差异,并以此建立了油膜厚度方程。运用有限差分法求解二维Reynolds方程,得到了流体动压力及膜厚的分布曲线。分析讨论了工况参数对最小油膜厚度的影响,表明最小油膜厚度随着走丝速度及研磨液粘度的增加而增加,随着锯丝转角的增加而减小。
Based on the theory of hydrodynamic lubrication, hydrodynamic action in the free abrasive monocrystalline silicon slicing process using a wiresaw was studied. Through self-compliance influence coefficient, the difference of deformation under distributed radial load of every node on the wire is embodimented, which is beneficial to form the film thickness equation. The finite difference numerical methods were used to solve the two-dimension Reynolds equation, then the distributions of hydrodynamic pressure and film thickness were yielded. The effects of machining parameters were discussed,result shows that the minimum film thickness increases with the increase of wire speed and slurry viscosity, while decreases with the increase of wire bow.
出处
《润滑与密封》
EI
CAS
CSCD
北大核心
2006年第10期81-83,共3页
Lubrication Engineering
基金
国家自然科学基金资助项目(50475132)
关键词
单晶硅
自由磨料线锯
自柔顺系数
流体动压效应
monocrystalline silicon
free abrasive wiresaw
self-compliance influence coefficient
hydrodynamic action
