摘要
IC智能卡使用过程中出现的密码校验失效、数据丢失、应用区不能读写等一系列失效和可靠性问题,严重影响了其在社会生活各领域的广泛应用.分析研究了IC智能卡芯片碎裂、引线键合断裂、静电放电损伤等失效模式和失效机理,并结合IC卡制造工艺和失效IC卡的分析实例,对引起这些失效的根本原因作了深入探讨,就提升制造成品率、改善可靠性提出应对措施.
Failures of IC smart cards,caused by fracture of thin/ultra-thin Si chip,break of wire bonding or ESD etc. have been seriously affecting their application. The corresponding failure modes and failure mechanisms are studied in detail,and the root cause resulting in such faliures are deeply investigated.Meanwhile,the measures for reducing the failure rate are suggested.
出处
《复旦学报（自然科学版）》
CAS
CSCD
北大核心
2005年第1期149-154,共6页
Journal of Fudan University：Natural Science
