摘要
通过测定会不同浓度的α，α′-联吡啶、亚铁氰化钾、L-精氨酸的Na2EDTA-柠檬酸钠双络合剂化学镀铜液的极化曲线，研究了这些添加剂及其不同的搭配组合在化学镀铜液中的作用和使用效果。其中L-精氨酸在一定浓度范围内能明显地促进CU2＋的还原反应，从而提高沉铜速率，测定结果与称重法测得的沉铜速率基本一致。
The effects of a'-bipyridyl,potassium ferocyanide,L-arginine and their different combinations on electroless Cu deposition were studied by drawing polarization curves of electroless copper plating in Na, EDTA-Na3C6H5O7 HCHO bath containing additives .L-arginine accelerated obviously HCHO oxidation and enhanced electroless deposition rate in a specific range of concentraton. The experimental results agreed roughly with the obtained by weight gain measurement.
出处
《材料保护》
CAS
CSCD
北大核心
1997年第1期8-10,共3页
Materials Protection
