摘要
采用化学镀方法对平均粒度为3μm的钼粉进行化学镀铜,温度和pH值分别控制在55～75℃和11.5～13。利用X射线衍射分析镀后粉末的相组成,用SEM观察未镀铜和镀铜粉末的形貌。结果表明,温度65℃、pH值12.5为化学镀铜的最佳工艺,此时,铜含量达到46%（质量分数,下同）。提出了钼粉表面镀铜层生长的＂扩散-缩小自催化＂模型。
Mo powders of 3μm in mean particle size have been coated with copper by electroless plating technique in the pH of 11.5～13 and at temperature range of 55～75℃. The phase component of coated powder was determined by X-ray diffraction （XRD）, and the powder morphology observed by scanning electron microscope （SEM）. The results indicate that the optimum process for the electroless plating copper is at temperature of 65℃ and in pH of 12.5, in which the coating is of a bright maroon color with 46% （mass fraction） copper. The growth mechanism of electroless coating over the surface is diffusion-shrinkage self-catalytic model.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2008年第8期1491-1494,共4页
Rare Metal Materials and Engineering
关键词
钼粉
化学镀铜
生长模型
molybdenum powder
electroless plating copper
growth model
