摘要
采用单因素优选实验法研究了影响化学镀铜速率和甘油铜镀液稳定性的各因素,确定了适宜的甘油铜化学镀液配方和工艺条件.结果表明,优选出的的镀液稳定性相对较高、沉铜速度快、镀层外观较好.
The factors affecting the deposition rate of copper and stability of electroless copper plating solution were investigated. The formulation of bath solution and processing parameters were established by the research. The results show that the proposed bath solution was highly stabile, by which cupper plating had high deposition rate with good appearence. Therefore, the copper-glycerin camplex solution shows a good prospect for copper plating.
出处
《腐蚀科学与防护技术》
CAS
CSCD
北大核心
2007年第3期178-180,共3页
Corrosion Science and Protection Technology
基金
江苏省教育厅科学研究计划项目(JHZD04-021)
关键词
甘油铜络合物
化学镀铜
沉铜速度
镀液稳定性
copper - glycerin complex
electroless copper plating
deposition rate
bath stability
