摘要
基于微通道板材料和结构特性,分析了微通道板工艺制造过程中表面污染物的来源,并对其成分进行分析和归类。针对污染物的不同类型和形态,提出了相应的物理、化学清洗方法,主要包括:有机溶剂清洗、清洗液清洗、超声清洗等技术。通过理论分析及实验总结找出了适用于微通道板不同工序的清洗技术及工艺参数,为提高微通道板的表观质量提供了有效的清洗方法。
According to the characteristics of material and construction of microchannel plate, the type and origin of contamination in the process of manufacturing microchannel plate （MCP） were analyzed and categorized. Contra-posing the type and category different contaminations, the corresponding cleaning methods including chemical and physical cleaning were described, primarily including cleaning technique of organism, cleaning liquid, ultrasonic etc. Cleaning solution and technology parameters in different procedures of manufacturing MCP are confirmed by theoretically analysis and experiments. The effective cleaning method was provided for improving the surface quantity of MCP.
出处
《半导体技术》
CAS
CSCD
北大核心
2007年第5期413-416,共4页
Semiconductor Technology
