摘要
介绍了半导体IC制程中存在的各种污染物类型及其对IC制程的影响和各种污染物的去除方法,并对湿法和干法清洗的特点及去除效果进行了分析比较。
The primary introduction of the type and the impact of contamination in semi-conductor IC processing are given, and described the method of contamination removal, analyzedthe feature of wet cleaning and dry cleaning, and the effect of contamination removal.
出处
《半导体技术》
CAS
CSCD
北大核心
2003年第9期44-47,共4页
Semiconductor Technology
