摘要
利用CMT(cold metal transfer)技术在30CrMnSi钢板表面熔敷CuSi3;采用背散射、能谱分析及X射线衍射等方法对接头区显微组织及成分进行了研究。结果表明,CMT技术实现了熔敷层与基体的冶金结合,送丝速度为5.0 m/min,焊接速度为17.0 mm/s时,稀释率极低;界面区由Fe3Si化合物、α-Fe及ε-Cu组成。送丝速度较低时,界面结构为Fe3Si/α-Fe+ε-Cu/α-Fe,熔敷区出现Fe2Si化合物;提高送丝速度,界面结构为Fe3Si+α-Fe+ε-Cu/α-Fe+ε-Cu,Fe2Si化合物被Fe3Si化合物取代;进一步提高送丝速度,界面结构为α-Fe+ε-Cu,弥散分布的球状富铁相聚合成长为星状及大块团状的α-Fe固溶体。送丝速度的变化对熔敷区组织具有显著影响。
A cladding of Cusi3 was deposited on the suface of 30CrMnSi steel by the method of cold metal tromsfor(CMT).The microstructure characteristics and compositions were investigated by back scattered electrons,energy dispersive X-ray spectrometry and X-ray diffractioin.The results show that the metallurgical bond of cladding and base metal is carried out with CMT technology.When wire feeding speed(vs)is 5.0 m/min and welding speed is 17 mm/s,the rate of dilution is extremely low.Fe3Si,α-Fe,ε-Cu formed in the interface.The interface microstructures are Fe3Si/α-Fe+ε-Cu/α-Fe when vs is slow.The feeding speed have a significant influence on the cladding layer.With the increase of vs,the interface microstructure change to Fe3Si+α-Fe+ε-Cu/α-Fe+ε-Cu.When vs is high,the structure of α-Fe+ε-Cu is obtained.With the increase of vs,Fe-rich phase in the cladding increased dramatically,gathered and grew from disperse nodular phase to stellated αFe solid solution.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2007年第2期47-50,共4页
Transactions of The China Welding Institution
基金
哈尔滨工业大学优秀青年教师培养计划项目(HITQNJS.2006.001)
关键词
30CrMnSi
CuSi3
表面熔敷
铜熔敷层
组织结构
30CrMnSi steel
CuSi3 copper alloy
cold metal transfer surface cladding
Cu cladding layer
miorostuneture
