摘要
电子产品无铅化对FR-4材料提出了更高的热性能要求,文章论述了在无铅化实行过程中FR-4材料在中高端刚性PCB制程中的应用表现,对高多层刚性PCB设计及加工提供指引。通过对FR-4进行分类试验,对高多层刚性PCB的CAM设计进行以材料表现为重点的分析。
Lead free solder of electronic products require FR-4 materials have more outstanding heat-resistant performance. In this paper behave＇of laminates applied in high technology rigid PCB are summarized. The results are useful to muti＇layer PCB design and manufacture, in the experiment PCB CAM design focus on laminates performance is analyzed.
出处
《印制电路信息》
2007年第1期21-24,29,共5页
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