摘要
利用热弹塑性有限元方法,通过瞬态热结构直接耦合,模拟Si3N4陶瓷二次部分瞬间液相连接过程,分析了连接接头残余应力分布状态和中间层对此连接接头应力分布的影响。结果表明:陶瓷外表面靠近连接界面的附近存在最大拉伸应力;采用Ti/Cu/Ni/Cu/Ti中间过渡层的接头应力出现大幅度的降低;陶瓷与金属之间热膨胀系数的巨大差异是导致残余应力的主要原因,采用中间过渡层能缓和接头的残余应力,提高接头强度。
The bonding course of double partial transient liquid phase in Si3N4 ceramic was firstly simulated by using the method of thermal elastic-plastic finite element analysis and transient thermal structure. Then resident stress distribution of joints and the influence of interlayers were investigated. Computation results show the largest stress lies in the surface of ceramic. The resident stress of joints with an interlayer of Ti/Cu/Ni/Cu/Ti is lower. It is considered that the difference of thermal expansion coefficient between ceramic and metal leads to the large resident stress of joints. At the same time multi-interlayer not only reduces the resident stress of joints but also improves the strength.
出处
《邢台职业技术学院学报》
2006年第5期87-89,共3页
Journal of Xingtai Polytechnic College
关键词
瞬间液相连接
残余应力
数值模拟
SI3N4
partial transient liquid
resident stress： numerical simulation
Si3N4
