摘要
陶瓷与金属的连接技术是材料工程领域的热点研究课题，而扩散连接方法被认为是陶瓷与金属连接最适宜的方法。本文综述了陶瓷与金属扩散连接的研究现状，重点介绍了界面反应研究、残余应力分析和连接工艺研究等内容，并在此基础上指出了研究中所存在的问题。
The bonding technique of ceramics to metals is one of the central issues in materials engineering, and diffusion bonding is considered to be the most suitable method for bonding ceramics to metals. The research status quo of diffusion bonding of ceramics to metals is reviewed in this paper, and the emphases are placed on the interface reaction, stress analysis and bonding technology. Based on this, the unsolved issues in researches are pointed out.
出处
《焊接》
2000年第9期7-12,共6页
Welding & Joining
关键词
陶瓷/金属接头
扩散连接
界面反应
应力分析
ceramic -metal joint, diffusion bonding, interface reaction, stress analysis
