摘要
提出一种可有效降低测试误差的剪切强度测试方法。用该方法对Sn-Ag-Bi无铅焊料分别在Cu基板和Ni-P基板上的焊点,经不同的热时效后的剪切强度,进行了测量并对断裂面的微观结构进行了研究。结果显示,焊点的剪切强度及断裂位置与焊接界面金属间化合物(IMC)的组成和厚度有关。
A new shear test method was proposed, by which the testing errors were effectively suppressed. With the new test method, Sn-3Ag-3Bi lead-free solder joints on Cu and Ni-P board for aging up to 1 000 hours were tested respectively. Moreover, the microstructures of solder joints facture surface were studied, The data showed that shear strength and fracture location of joints are related to the composition and thickness of the intermetallic compound （IMC） at the interface between solder and board materials.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2006年第10期34-36,共3页
Electronic Components And Materials
基金
APEC科技产业合作基金资助项目
