摘要
清华大学材料科学与工程系电子材料与封装技术研究室研制了6个系列的无铅焊料:Sn-3.5Ag添加Cu或Bi; Sn-3.5Ag-1.0Cu添加In或Bi; Sn-Ag-Cu-In添加Bi; Sn-Ag-Cu添加Ga; Sn-Zn添加Ga; Sn-Zn添加多种元素。重点介绍了Sn-Zn添加多种元素。对6个系列无铅焊料的研究取得了较好的实验结果,得到比较理想的低温焊料体系,有的合金熔点已非常接近铅锡共晶焊料熔点183℃。
Six series of lead-free solder alloys have been investigated by School of Material Science & Engineering of Tsinghua University: Sn-3.5Ag addition Cu and Zn system, Sn-3.5Ag-1.0Cu addition In and Bi system, Sn-Ag-Cu-In-Bi system, Sn-Ag-Cu addition Ga system, Sn-Zn addition Ga system and Sn-Zn addition 4 elements system, especially the last one. Results indicate that melting point for some lead-free solders can be decreased to fewer than 200C and those lead-free alloying solders have excellent application characteristics.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第11期45-48,共4页
Electronic Components And Materials
关键词
金属材料
无铅焊料
熔点
研究与发展
metal materials
lead-free solder
melting point
research and development
