摘要
研究了一种低氰电镀光亮22K金工艺。探讨了工艺流程、工艺配方、操作条件、镀液中各组分的影响及镀液的维护。该工艺镀液稳定、分散能力及深镀能力好,镀层光亮,颜色鲜艳,金含量符合22K标准,适合做装饰品镀层。
A low cyanide bright 22K gold plating process was investigated. The process flow, technological formulation, operational conditions, effects of bath＇ s components on plating and bath maintenance were discussed. The results show that the process has features of stable solution, good throwing power and covering power, bright and good colored coating. The content of gold satisfies the 22K standard. The above process can be applied to decorative coating.
出处
《电镀与涂饰》
CAS
CSCD
2006年第8期13-15,共3页
Electroplating & Finishing
关键词
电镀合金
22K金
光亮
低氰
plating alloy
22K gold
bright
low cyanide
