摘要
介绍几种金基合金电镀的发展历程，比较几种镀液的性能特点并讨论几种金合金电镀的现况及未来的发展趋势。
The paper introduced the development of several gold-alloy plating,compared the character of several plating baths,and discussed present situation and development tendency for several gold-alloy plating.
出处
《贵金属》
CAS
CSCD
北大核心
1999年第1期53-57,共5页
Precious Metals
