摘要
采用以碳化硅为主相的焊料,在无压的条件下,连接氮化硅结合碳化硅陶瓷。结果表明:焊料在室温到1323K的干燥和烧结过程中,体积稳定,稍有膨胀。在1173K保温3h的条件下,连接的样品拉伸强度达到1.76MPa,热震残余强度保持率为82%。接头致密,并且焊料层与母材显微结构非常相似,界面处有明显的元素扩散,这对于提高结合强度和热震性能有重要作用。
A kind of adhesive, which was mainly composed of SiC, was used to join Si3N4/SiC ceramic presslessly. The results showed that the volume of the adhensive specimen is stable and have a little expansion when it was dried and sintered from room temperature to 1323K. The tensile strength was up to 1.76MPa when jointing at 1173K and holding 3 hours. The thermal shock residual strength remained 82% of its original strength. The joint zone was densified. The sintered adhesive and the parent material had similar microstructure and remarkable diffusion existed near the interface between them, which was beneficial to increase bonding strength and thermal shock resistance.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2006年第8期23-27,32,共6页
Journal of Materials Engineering
基金
陕西省科技攻关资助项目(2002K07-G5)
关键词
连接
碳化硅
焊料
结合强度
joining
silicon carbide
adhesive
bonding strength
