摘要
采用Ti活性中间层对ZrC--20%SiC复合陶瓷进行扩散焊连接,研究了活性元素Ti与复合陶瓷的界面反应机理,分析了焊接温度对接头微观组织以及力学性能的影响。结果表明:Ti与复合陶瓷发生界面反应,首先形成TiC化合物层,部分反应中间产物Zr原子固溶于TiC化合物中,其余部分扩散进入Ti中间层,形成固溶体;延长反应时间或提高焊接温度,Ti进一步与反应中间产物Zr、Si原子在靠近陶瓷一侧生成Ti--Zr--Si三元相,同时增加界面反应层的厚度。焊接接头的剪切强度随温度由900℃升高到1 200℃先提高后降低,在压力为20MPa及1 000℃保温30min条件下,达到最大值(149MPa)。
ZrC-20%SiC composite ceramic （ZS） was bonded with a pure Ti interlayer. The typical microstructure and interra- cial reaction mechanism of the ZS/Ti/ZS joint were analyzed. The effect of bonding temperature on the interfacial microstruc- ture and mechanical property was investigated. The results show that the TiC compound is formed at the interface due to the interaction between Ti and ZrC-SiC composite. The atoms of Zr and Si release as the intermediate products. A portion of Zr at- oms are diffused into the TiC layer and the remains are diffused into the Ti interlayer as solid solution atoms. The Ti-Zr-Si phase is formed nearby the ZtC-SiC composite at a higher bonding temperature or a longer bonding tim~ The thickness of the formed reaction layer increases. The shear strength of the diffusion bonded joints firstly increases and then decreases when the bonding temperature in- creases from 900 ℃ to 1 200 ℃. The maximal value is 149 MPa when bonded at 1 000 ℃ under 20 MPa for a0 mln
出处
《硅酸盐学报》
EI
CAS
CSCD
北大核心
2014年第3期275-279,共5页
Journal of The Chinese Ceramic Society
基金
国家自然科学基金(50975062
51275135
51021002)资助项目
关键词
碳化锆
碳化硅
复合陶瓷
扩散焊
界面组织
中间层
zirconium carbide
silicon carbide
composite ceramic
diffusion bonding
interfacial microstructure
interlayer
